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SEM Topography

ID : #9374764
Scan size : 16,384 x 16,384 pixels max.
Shipping weight : typ. 7.5 kg
Video processor weight : 1.1 kg
PC/Laptop : Intel Core i3, 2x USB 2.0 minimum

testProduct Specification

Category:

Hardware

Turnkey add-on system for any SEM

  • Backscattered electron detector
  • Multi-channel video processor
  • Scan generator and image acquisition
  • Live surface topography software

Multi-segment solid-stage backscattered electron detectors

  • Monolithic or hybrid quadrant sensors for high resolution
  • Optional light blind sensors for high temperature/in situ SEM
  • In situ pre-amplification for minimum noise and maximum speed

Video processor for simultaneous data acquisition

  • Channel independent brightness and contrast controls
  • Hardware mixed output for simultaneous acquisition with SE, BSE, EBIC, CL, or EDS
  • USB controlled and fully integrated with the acquisition software

The most powerful and versatile SEM scanning system – DISS5

  • Integrated scan generator and image acquisition
  • Very large image resolution, up to 16k x 16k pixels
  • Very fast scanning speed, down to 200ns dwell time
  • Simultaneous 4x analogue and 12x digital counter inputs

Software

Completely integrated control and acquisition

  • Live surface height reconstruction from BSE signals
  • Built-in 3D surface visualisation tool
  • Configurable workflows with integrated SE and BSE scan profiles

Reconstructed height is purely topographic and quantitative

  • Surface normals are calculated from 4x BSE gradients at each beam position
  • Complete surface topography is assembled from all surface normals
  • Height resolution depends primarily on beam/sample interaction volume

Live height visualisation tool

  • Pan, rotate, tilt, zoom and scale Z
  • Enhance with shadows and custom colour coding
  • Export to standard binary AL3D and plain text SDF formats

One step calibration software with dedicated SEM standard – m2c

  • Calibration of scale in all three spatial directions
  • Orthogonality of all axes (shearing)
  • Analysis of nonlinear deviations

Measure surface topography with SEM

  • Use conventional segmented BSE signals
  • Get immediate feedback with automated topographic reconstruction
  • Save topographic data in standard surface file formats

Distinguish between sample composition and surface topography

  • Resolve ambiguities in image interpretation
  • Reach a wider audience with 3D models, visualisation and printing
  • Measure 3D distances, volumes, steps, roughness, texture…

Monitor FIB milling and GIS deposition

  • Improve yield of TEM and atom probe sample preparation
  • Verify thickness of GIS deposited layers
  • Monitor FIB milling depths and roughness

Visualise complex surfaces with ease

  • Add texture from SE, EDS or EBSD maps
  • Manipulate automatic colour textures
  • Extract 3D screenshots for high-impact visualisation

Calibrate and measure height from offline BSE data

  • Calibrate measurements with dedicated calibration sample
  • Measure 3D positions, distances and angles
  • Measure height and texture for visualisation and analysis

Continue live topography workflow with off-line analysis

  • Import data into full feature analysis software
  • Measure surface roughness and analyse texture
  • Analyse morphology, grain and particle distributions

Backscattered (BSE) detector

  • Sensor geometry: 4x quadrant diodes (monolithic sensor), or 4x rectangular diodes (hybrid sensor)
  • Sensor min. energy: 1keV for detector grade Si diodes, or 5keV for standard Si diodes
  • Sensor mount: retractable arm, or pole piece mount
  • Sensor height: 1.2 mm
  • Pre-amplifier mount: in situ
  • Pre-amplifier gain: 10^7 V/A fixed
  • Pre-amplifier size: 22 x 18 mm

Video processor module

  • Hardware interface: USB 2.0
  • BSE signal inputs: 4x max.
  • SE and AUX signal inputs: 3x max.
  • Simmultaneous output signals: 4x max.
  • Mixed BSE output: 1x conventional compo.
  • Gain: 1 … 100x
  • Output offset: 1.25V max
  • Brightness and Contrast control: integrated software control
  • Signal inversion: Yes
  • Low-pass filter: 8-levels

Topography calibration sample (m2c)

  • GIS deposited calibration structures: 3x multi-level pyramidal, 1x spherical element
  • FIB milled recognition structure: nanomarkers
  • Total area: 80 x 80 μm, or 40 x 40 μm
  • Nanomarker geometry: 800 nm, or 600 nm
  • Pyramidal element geometry: 90 x 90 x 3 µm, or 45 x 45 x 1.8 µm
  • Spherical element geometry: 10 x 10 x 1 µm
  • Reference data: CD/ROM

SEM topography acquisition module (DISS 5 Topography)

  • Hardware interface: USB 2.0
  • Simultaneous inputs (i.e. SE, BSE): 4x, 12-bit
  • Mapping signals (i.e. EDS): 12x, 12-bit
  • Scanning interface: pre-configured for SEM and analytical add-ons
  • Synchronization interface: pixel, line, frame
  • Scan size: 16,384 x 16,384 pixels max.
  • Pixel dwell time: 200 ns … 6 milliseconds
  • Pixel over-sampling: 32,000x max.
  • Line averaging: 50x max.
  • Frame averaging: 256x max.
  • Synchronization: mains power
  • ROI scan: yes

PC/Laptop, Display

  • PC/Laptop: Intel Core i3, 2x USB 2.0 minimum
  • Display: 1,280 x 1,024 resolution minimum, 2x displays recommended
  • Operating systems: Windows 10 … Windows XP
  • Network connection: recommended

Acquisition software (DISS 5 Topography)

  • BSE detector control: complete software integration
  • SEM mag, kV information: automated SEM communication
  • SEM topography reconstruction: live automatic shape-from-shade (m2c)
  • SEM topography display: 3D visualisation, mountain view
  • SEM topography control: live rotation, pan, tilt, zoom, height-rescalling
  • SEM topography texture: solid colour, height-coded colour LUT
  • Image mixing tool: independent colour/channel, independent intensity/channel, topographic and compositional profiles
  • Scan profile templates: live display, region of interest (ROI), slow scan, area mapping, line scan, video recording (AVI)
  • Signal monitor: analogue signals profiles, level meter graphs, gradation graph tool
  • Software API: yes
  • Image caption overlay: yes
  • Default BSE image file formats: 8 and 16-bit multi-page TIFF
  • Default topography file formats: AL3D, SDF
  • Export image file formats: BMP, JPEG, PNG, GIF
  • Export topography file formats: BMP
  • Operating system: Windows 10 … Windows XP
  • Context sensitive help: English, German

Analysis software (microCal and micro-Shape from m2c)

  • XYZ calibration: one step calibration with dedicated calibration structure
  • Data extraction: point and line profiles
  • 3D measurements: distances, angles
  • Save file formats: BCR, BCRF, AL3D, NMM, ASC
    Export file formats: PLY, TIF, BMP, JPG, PNG, GIF, TXT, DAT
  • Operating system: Windows 10 … Windows XP
  • Context sensitive help: English, German

Parts and Cables

  • BSE sensor: optional 1x
  • BSE pre-amplifier: optional 1x
  • BSE insertion/retraction mechanism: optional 1x
  • BSE in situ cable: optional 1x
  • BSE vacuum electrical feedthrough: optional 1x
  • BSE ex situ cable: standard 1x
  • Topography calibration sample: standard 1x
  • Video processor module: standard 1x
  • Video processor ground strap: standard 1x
  • SEM mixed control & acquisition cable: standard 1x
  • SEM acquisition module: standard 1x
  • USB cables: standard 2x
  • USB memory stick: standard 1x
  • PC, keyboard, mouse: optional 1x
  • Displays: optional 2x

Software packages

  • Video Processor USB driver: Video Processor
  • SEM acquisition USB driver: Digital Image Scanning System 5
  • Shape-from-shadow library: m2cMicroShape (m2c)
  • Acquisition software: DISS 5
  • Analysis software: microShape (m2c)
  • Calibration software: microCal (m2c)

Weight and Dimensions

  • Video processor dimensions: 19 x 10.5 x 5 cm
  • Video processor weight: 1.1 kg
  • DISS5 module dimensions: 23.5 x 8.7 x 29.5 cm
  • DISS5 module weight: 3.4 kg
  • Shipping dimensions: typ. 36 x 32 x 56 cm
  • Shipping weight: typ. 7.5 kg

Site requirements

  • Power: 2x mains 110/220 VAC single phase 50-60 Hz, on the same earth as the microscope
  • SEM chamber: 1x flange prepared for muti-pin vacuum electrical feedtrough to pre-amplifier
  • SEM earth: 1x ground strap
  • SEM interface: 1x external analogue interface for XY scan control and SEM signals
  • Space: video processor module must be placed in close proximity of the SEM chamber, power supply and DISS5 modules may be placed on the SEM bench

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