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EBIC acquisition

ID : #9374764
Scan size : 16,384 x 16,384 pixels max.
Shipping weight : typ. 7.5 kg
Video processor weight : 1.1 kg
PC/Laptop : Intel Core i3, 2x USB 2.0 minimum

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Category: Products

Hardware

Turnkey add-on system for any SEM

Backscattered electron detector
Multi-channel video processor
Scan generator and image acquisition
Live surface topography software

Multi-segment solid-stage backscattered electron detectors

Monolithic or hybrid quadrant sensors for high resolution
Optional light blind sensors for high temperature/in situ SEM
In situ pre-amplification for minimum noise and maximum speed

Video processor for simultaneous data acquisition

Channel independent brightness and contrast controls
Hardware mixed output for simultaneous acquisition with SE, BSE, EBIC, CL, or EDS
USB controlled and fully integrated with the acquisition software

The most powerful and versatile SEM scanning system – DISS5

Integrated scan generator and image acquisition
Very large image resolution, up to 16k x 16k pixels
Very fast scanning speed, down to 200ns dwell time
Simultaneous 4x analogue and 12x digital counter inputs

Software

Completely integrated control and acquisition

Live surface height reconstruction from BSE signals
Built-in 3D surface visualisation tool
Configurable workflows with integrated SE and BSE scan profiles

Reconstructed height is purely topographic and quantitative

Surface normals are calculated from 4x BSE gradients at each beam position
Complete surface topography is assembled from all surface normals
Height resolution depends primarily on beam/sample interaction volume

Live height visualisation tool

Pan, rotate, tilt, zoom and scale Z
Enhance with shadows and custom colour coding
Export to standard binary AL3D and plain text SDF formats

One step calibration software with dedicated SEM standard – m2c

Calibration of scale in all three spatial directions
Orthogonality of all axes (shearing)
Analysis of nonlinear deviations

Measure surface topography with SEM

Use conventional segmented BSE signals
Get immediate feedback with automated topographic reconstruction
Save topographic data in standard surface file formats

Distinguish between sample composition and surface topography

Resolve ambiguities in image interpretation
Reach a wider audience with 3D models, visualisation and printing
Measure 3D distances, volumes, steps, roughness, texture…

Monitor FIB milling and GIS deposition

Improve yield of TEM and atom probe sample preparation
Verify thickness of GIS deposited layers
Monitor FIB milling depths and roughness

Visualise complex surfaces with ease

Add texture from SE, EDS or EBSD maps
Manipulate automatic colour textures
Extract 3D screenshots for high-impact visualisation

Calibrate and measure height from offline BSE data

Calibrate measurements with dedicated calibration sample
Measure 3D positions, distances and angles
Measure height and texture for visualisation and analysis

Continue live topography workflow with off-line analysis

Import data into full feature analysis software
Measure surface roughness and analyse texture
Analyse morphology, grain and particle distributions

Backscattered (BSE) detector

Sensor geometry: 4x quadrant diodes (monolithic sensor), or 4x rectangular diodes (hybrid sensor)
Sensor min. energy: 1keV for detector grade Si diodes, or 5keV for standard Si diodes
Sensor mount: retractable arm, or pole piece mount
Sensor height: 1.2 mm
Pre-amplifier mount: in situ
Pre-amplifier gain: 10^7 V/A fixed
Pre-amplifier size: 22 x 18 mm

Video processor module

Hardware interface: USB 2.0
BSE signal inputs: 4x max.
SE and AUX signal inputs: 3x max.
Simmultaneous output signals: 4x max.
Mixed BSE output: 1x conventional compo.
Gain: 1 … 100x
Output offset: 1.25V max
Brightness and Contrast control: integrated software control
Signal inversion: Yes
Low-pass filter: 8-levels

Topography calibration sample (m2c)

GIS deposited calibration structures: 3x multi-level pyramidal, 1x spherical element
FIB milled recognition structure: nanomarkers
Total area: 80 x 80 μm, or 40 x 40 μm
Nanomarker geometry: 800 nm, or 600 nm
Pyramidal element geometry: 90 x 90 x 3 µm, or 45 x 45 x 1.8 µm
Spherical element geometry: 10 x 10 x 1 µm
Reference data: CD/ROM

SEM topography acquisition module (DISS 5 Topography)

Hardware interface: USB 2.0
Simultaneous inputs (i.e. SE, BSE): 4x, 12-bit
Mapping signals (i.e. EDS): 12x, 12-bit
Scanning interface: pre-configured for SEM and analytical add-ons
Synchronization interface: pixel, line, frame
Scan size: 16,384 x 16,384 pixels max.
Pixel dwell time: 200 ns … 6 milliseconds
Pixel over-sampling: 32,000x max.
Line averaging: 50x max.
Frame averaging: 256x max.
Synchronization: mains power
ROI scan: yes

PC/Laptop, Display

PC/Laptop: Intel Core i3, 2x USB 2.0 minimum
Display: 1,280 x 1,024 resolution minimum, 2x displays recommended
Operating systems: Windows 10 … Windows XP
Network connection: recommended

Acquisition software (DISS 5 Topography)

BSE detector control: complete software integration
SEM mag, kV information: automated SEM communication
SEM topography reconstruction: live automatic shape-from-shade (m2c)
SEM topography display: 3D visualisation, mountain view
SEM topography control: live rotation, pan, tilt, zoom, height-rescalling
SEM topography texture: solid colour, height-coded colour LUT
Image mixing tool: independent colour/channel, independent intensity/channel, topographic and compositional profiles
Scan profile templates: live display, region of interest (ROI), slow scan, area mapping, line scan, video recording (AVI)
Signal monitor: analogue signals profiles, level meter graphs, gradation graph tool
Software API: yes
Image caption overlay: yes
Default BSE image file formats: 8 and 16-bit multi-page TIFF
Default topography file formats: AL3D, SDF
Export image file formats: BMP, JPEG, PNG, GIF
Export topography file formats: BMP
Operating system: Windows 10 … Windows XP
Context sensitive help: English, German

Analysis software (microCal and micro-Shape from m2c)

XYZ calibration: one step calibration with dedicated calibration structure
Data extraction: point and line profiles
3D measurements: distances, angles
Save file formats: BCR, BCRF, AL3D, NMM, ASC
Export file formats: PLY, TIF, BMP, JPG, PNG, GIF, TXT, DAT
Operating system: Windows 10 … Windows XP
Context sensitive help: English, German

Parts and Cables

BSE sensor: optional 1x
BSE pre-amplifier: optional 1x
BSE insertion/retraction mechanism: optional 1x
BSE in situ cable: optional 1x
BSE vacuum electrical feedthrough: optional 1x
BSE ex situ cable: standard 1x
Topography calibration sample: standard 1x
Video processor module: standard 1x
Video processor ground strap: standard 1x
SEM mixed control & acquisition cable: standard 1x
SEM acquisition module: standard 1x
USB cables: standard 2x
USB memory stick: standard 1x
PC, keyboard, mouse: optional 1x
Displays: optional 2x

Software packages

Video Processor USB driver: Video Processor
SEM acquisition USB driver: Digital Image Scanning System 5
Shape-from-shadow library: m2cMicroShape (m2c)
Acquisition software: DISS 5
Analysis software: microShape (m2c)
Calibration software: microCal (m2c)

Weight and Dimensions

Video processor dimensions: 19 x 10.5 x 5 cm
Video processor weight: 1.1 kg
DISS5 module dimensions: 23.5 x 8.7 x 29.5 cm
DISS5 module weight: 3.4 kg
Shipping dimensions: typ. 36 x 32 x 56 cm
Shipping weight: typ. 7.5 kg

Site requirements

Power: 2x mains 110/220 VAC single phase 50-60 Hz, on the same earth as the microscope
SEM chamber: 1x flange prepared for muti-pin vacuum electrical feedtrough to pre-amplifier
SEM earth: 1x ground strap
SEM interface: 1x external analogue interface for XY scan control and SEM signals
Space: video processor module must be placed in close proximity of the SEM chamber, power supply and DISS5 modules may be placed on the SEM bench